In collaboration with industry leaders like Arm and Keysight, will showcase its expertise in UCIe, HBM, and next-generation compute and I/O chip technologies.
Alphawave Semi has confirmed its participation in the upcoming Chiplet Summit Conference and Exhibition, scheduled for January 21-23 at the Santa Clara Convention Center. The company will exhibit its latest advancements at booth 500.
Chief Technology Officer Dr. Tony Chan Carusone will deliver a keynote titled “Scaling Connectivity for Chiplet-Based AI Systems.” Additionally, Alphawave Semi’s technical team will present research papers and tutorials on die-to-die interfaces and the open UCIe standard. Letizia Giuliano, Vice President of IP Product Marketing & Management, will join a panel discussion on the challenges and opportunities of chiplet-based integrated circuit (IC) development.
The company will also collaborate with industry leaders Arm and Keysight to showcase advancements in chiplet ecosystems. Attendees at booth 500 will explore cutting-edge solutions aimed at overcoming networking bottlenecks in data centers. Highlights include:
- UCIe scaling to 64 Gbps, achieving over 20 Tbps/mm bandwidth density for enhanced die-to-die connectivity.
- Custom HBM4 solutions designed for AI data centers to optimize memory for high-performance compute applications.
- The industry’s first multi-protocol I/O connectivity chiplet, supporting high-performance computing and AI infrastructure.
- Energy-efficient accelerator cards integrating AlphaCHIP1600 I/O Chiplet and Arm Neoverse Compute Chiplets with next-generation connectivity technologies such as UCIe, HBM, Ethernet, PCIe, CXL, and SerDes.
Now in its third year, the Chiplet Summit continues to attract major players in AI, compute, and interconnect technologies. Exhibitor participation has grown by over 30% since 2023, reflecting the rising industry focus on chiplet innovations.
For more details, click here.
