The partnership will establish a continuous feedback loop between simulation and fabrication
CADFEM APAC has signed a Memorandum of Understanding (MoU) with SilTerra Malaysia, one of Malaysia’s leading semiconductor foundries and fabless design service providers.
The agenda behind this partnership is to boost growth of innovation through simulation-driven engineering, advanced digital workflows, and closer integration between design and manufacturing processes.
In today’s world, as the semiconductor industry faces significant pressure to deliver more advanced technologies while reducing development time, costs, and risks, the collaboration seeks to create a streamlined path from concept to silicon. By combining CADFEM APAC’s expertise in multiphysics simulation, predictive engineering, and digital transformation with SilTerra’s strengths in semiconductor manufacturing and process development, both companies aim to improve development efficiency and technology readiness.
An important aspect of this collaboration is the development of Design Technology Co-Optimisation (DTCO) and System Technology Co-Optimisation (STCO) frameworks. Such frameworks will integrate the device, process, and design domains into a unified digital environment, enabling faster technology exploration, improved validation, stronger model correlation, and reduced development risks.
The partnership will also explore the application of Agentic AI technologies to enhance semiconductor workflows. Solutions incorporating Natural Language Processing (NLP), Retrieval-Augmented Generation (RAG), AI-assisted Electronic Design Automation (EDA) environments, and Process Design Kit (PDK) integrations are expected to improve collaboration and accelerate chip development cycles.
“The future of semiconductor advancement will be defined by how effectively organizations can connect design, process development, and manufacturing within a unified engineering framework,” said Beng Joo Thung, Senior Vice President at SilTerra Malaysia. “By combining simulation-driven development with real manufacturing insight, we aim to accelerate innovation, improve development efficiency, and strengthen the industry’s ability to bring next-generation technologies to market with greater confidence.”
The partnership will establish a continuous feedback loop between simulation and fabrication, ensuring stronger alignment between design objectives and manufacturing outcomes. Both organisations will also explore reliability-focused methodologies to support demanding sectors such as automotive, industrial electronics, and other high-dependability applications.
Dr Ing. explained that the semiconductor industry is increasingly being defined by how quickly organisations can translate ideas into manufacturable technologies.
Madhukar Chatiri, CEO of CADFEM APAC. “By bringing together predictive engineering, simulation expertise, and manufacturing knowledge, this collaboration creates a stronger foundation for faster development, better design decisions, and reduced technology risk.”
Through this MoU, CADFEM APAC and SilTerra reaffirm their commitment to advancing semiconductor innovation, strengthening design-manufacturing integration, and supporting the continued growth of the Asia-Pacific semiconductor ecosystem.
