IEEE’s Electronic Component and Technology Conference (ECTC) 2027, is a premier conference for the world’s semiconductor packaging industry. It is to be held from June 1-4, 2027, at Gaylord Rockies Resort & Convention Centre in Denver, Colorado.
The 2027 IEEE Electronic Component and Technology Conference (ECTC) has announced a call for papers. ECTC 2027 will take place on June 1-4, 2027 at Gaylord Rockies Resort and Convention Center in Denver, Colorado.
It’s a premier technical conference and product exhibition for the world’s semiconductor packaging industry. More than 2500 scientists, engineers, and business people are expected to attend.
Abstract submissions open on August 17, 2026, and the final date of submission is October 5, 2026.
The ECTC 2027 technical program will address the latest developments, trends and applications in a wide range of advanced packaging topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP) and panel-level packaging (PLP), fan-out and fan-in packaging, flip-chip technologies, and other emerging technologies in electronic packaging.
Previously unpublished, the non-commercial paper abstracts are requested in the following areas:
· Applied Reliability
· Assembly and Manufacturing Technology
· Electrical Design and Analysis
· Emerging Technologies
· Interconnections
· RF, High-Speed Components & Systems
· Materials & Processing
· Packaging Technologies
· Photonics
· Thermal/Mechanical Simulation & Characterization
For complete details, one must visit ECTC website, online Call for papers.
Along with papers, applications are sorted from individuals who wish to teach educational, four-hour long, Professional Development Courses (PDCs) on topics relevant to the conference. The deadline for submission of PDC topics is October 19, 2026. Up to 16 PDCs will be selected for the 77th ECTC program on Tuesday, June 1, 2027.
