Hamamatsu Photonics has introduced a new design of back-thinned linear CCD image sensor. The S11155-2048-01 and S11156-2048-01 utilise a resistive gate structure, with ‘on chip’ electronic shutter function, high speed readout with low image lag and 2048 pixels. With their back-thinned structure the CCDs offer a high sensitivity (>80 % quantum efficiency) from the UV to the NIR region of the spectrum.
The resistive gate structure allows for very high-speed signal transfer by using a single high-resistance electrode formed in the active area. A signal charge is transferred by means of a potential slope, created by applying different voltages across the electrode. Compared to a conventional CCD area image sensor, which can be used as a linear image sensor via line binning, a one dimensional CCD with a resistive gate structure offers greater signal transfer speed, and significantly reduced image lag (less than 0.1%), even if the pixel height is large.
The S11155-2048-01 features 14µm by 500µm pixel height, while the S11156-2048-01 offers a larger 1000µm pixel height. The resistive gate structure allows both sensors to operate with a maximum readout speed of 10MHz.
The image sensors are ideal for spectrophotometers requiring a long sensor, with short integration time or fast readout, and for various industrial inspection applications requiring high speed image acquisition, says the company.
