- Discussions between the HCL Group and the state government are in progress
HCL Group’s Outsourced Semiconductor Assembly and Test (OSAT) facility is near completion in Karnataka. It will be known as a chip packaging unit.
The investment in this facility is almost $400 million. Discussions between the HCL Group and the state government are in progress. Proposed sites include locations near Bengaluru’s international airport and in Mysuru.
Mysuru’s ample water resources make it an ideal location for fab manufacturing and OSAT, supported by state government incentives. HCL Group’s return to tech hardware underscores its historic leadership in India’s IT manufacturing.
In response to queries, an HCL Group spokesperson stated, “We evaluate investment opportunities and report progress at the appropriate time.” This move aligns with HCL’s ambition to penetrate the semiconductor space, building upon its previous endeavours and collaborations within the chip ecosystem.
