Rival chipmaker SK Hynix is also reportedly assessing opportunities in Honam
Samsung Electronics is seeking potential locations in South Korea’s Honam region to expand its semiconductor manufacturing capacity, says few reports.
According to several sources, the company is searching for several sites, including Gwangju and Saemangeum, for what could become its first semiconductor back-end packaging facility in the Honam region.
There are multiple options which could be considered. Gwangju appears as the main candidate due to its established semiconductor ecosystem and the presence of multiple assembly and testing companies.
SK Hynix, a rival chipmaker, is also reportedly assessing opportunities in Honam, with Gwangju and Muan as potential locations for future semiconductor investments. Neither company currently operates semiconductor manufacturing facilities in the region.
The growing demand for AI infrastructure has boosted the need for advanced chip production and packaging capabilities.
Currently, Samsung operates semiconductor packaging operations in Cheonan and Onyang. Expanding into Honam could provide additional manufacturing capacity while leveraging the region’s ample land availability and strong water and power infrastructure.
Despite the reports, Samsung Electronics has denied it and said there no final decision has been made. The new packaging plant is still to be decided. Gwangju also confirmed this and said that formal discussions with the company are still pending.
