Rao R Tummala highlights the global shift to system on package and brings proven semiconductor collaboration models to India.
A two-day Indo-Taiwan conference on semiconductor packaging and testing was organised by SASTRA Deemed University, bringing together experts from industry and academia across India and Taiwan. The event saw participation from more than 140 delegates representing 20 industries and 25 academic institutions, underscoring growing international collaboration in the semiconductor sector.
Held in association with Lunghwa University of Science and Technology and supported by the SPARC scheme of the Ministry of Education, Government of India, the conference focused on advances in chip packaging, testing and industry academia partnerships. A press release said the discussions highlighted the strategic importance of strengthening semiconductor ecosystems through global cooperation.
Rao R Tummala, advisor to the India Semiconductor Mission, addressed the conference and spoke about the global transition from System on Chip to System on Package technologies. He also outlined his globally tested model of Industry Co development Centres and shared plans to replicate the approach in India to accelerate the growth of the domestic semiconductor industry.
S Vaidhyasubramaniam, Vice Chancellor of SASTRA Deemed University, highlighted the institution’s sustained academic and research collaborations with Taiwanese universities. He noted that such partnerships are vital for building technical capability and research depth in India’s semiconductor landscape.
On the sidelines of the conference, an MoU was signed between SASTRA Deemed University and PTW Semiconductor India Pvt Ltd to promote closer industry academia collaboration.
Po Hsueh Chang from Lunghwa University of Science and Technology, Venkatesh Kumar Pandurengan of PTW Semiconductor India Pvt Ltd and R John Bosco Balaguru of SASTRA Deemed University were among those present at the event.
