- It is expected to grow at a CAGR of 3.6 per cent from 2021 to 2026
- It said that notable R&D investments and technological advances have increased the demand for reliable and high-performance miniaturised electronic components
The global Semiconductor Bonding Market size is projected to grow from $887 million in 2021 to $1,059 million by 2026 as per a report by MarketsandMarkets. It is expected to grow at a CAGR of 3.6 per cent from 2021 to 2026.
It said that notable R&D investments and technological advances have increased the demand for reliable and high-performance miniaturized electronic components, like microelectromechanical systems (MEMS) and microoptoelectromechanical systems (MOEMS), from high-growth and high-value industries, including aerospace, military, automotive, consumer electronics, and medical.
Die bonder equipment are extensively being used for the assembly and packaging of MEMS and MOEMS devices. MEMS and MOEMS devices find applications in sensors, robotics, microvalves, flow controllers, global positioning systems (GPS), and biotechnology. The microfabrication capability of die bonders makes them suitable l for the assembly and packaging of MEMS and MOEMS.
Advancements in electronic devices with the adoption of the latest semiconductor technology
It added that advancements in electronic devices with the adoption of the latest semiconductor technology have led to the development of multi-chip modules (MCM) in logic ICs, memory chips, RF devices, and sensors, which can be integrated into smaller systems and miniature electronic devices. Also, 3D-integrated ICs, MEMS, and MCM have made it possible to mount small form factor electronic components on a substrate.
Due to this, significant R&D investments by many companies, die bonders offering placement accuracy of more than 5 ìm are available to ensure high-speed and high-precision assembly of MCMs, MEMS devices, and other components and enable miniaturization of electronic devices without loss of performance. Die bonder equipment facilitate the assembly of power devices, high-power communication devices, LED packages, servers, and portable electronics. The capability of die bonders to assemble nano-sized components for miniaturized electronic devices is driving the growth of the semiconductor bonding market.
Die bonder is expected to be the largest type segment of the semiconductor bonding market with market size of $410.6 million in 2021. Increasing demand for miniature electronic components is a major driving factor for the growth of the die bonder equipment market.
Increasing demand for 3D semiconductor assembly and packaging is an opportunity for the manufacturers in the die bonder equipment market. But the high cost of ownership is hindering the growth of the market. .
