to foster collaboration and development in the semiconductor industry, Taiwan and the Czech Republic aim to build a semiconductor cluster in Europe, leveraging TSMC’s Dresden fab, noted officials at the GLOBSEC Forum.
Taiwan plans to collaborate with the Czech Republic to establish a semiconductor cluster in Europe, according to the National Security Council Secretary-General Joseph Wu.
Speaking at a news conference during the GLOBSEC Forum in Prague, Wu emphasised Taiwan’s goal of partnering with Czech chipmakers and leveraging Taiwan Semiconductor Manufacturing Company (TSMC)’s new wafer fab in Dresden to create a European semiconductor hub over the next three to five years.
Czech officials, including Speaker of the Chamber of Deputies Markéta Pekarová Adamová, have indicated a willingness to offer tax incentives to attract Taiwanese investments.
Wu noted that TSMC’s European expansion requires a robust supply chain, and the Czech Republic’s focus on the semiconductor industry makes it an ideal partner. He stated the importance of stable infrastructure, such as reliable electricity, water supplies, and skilled engineers for Taiwanese investment.
Discussions between Taiwanese and Czech representatives also covered strengthening economic cooperation, addressing semiconductor supply needs, and developing an industrial cluster and talent pool.
In June, a Taiwanese delegation explored investment opportunities in Czechia, and both nations are currently looking to collaborate on high-end technologies like artificial intelligence and the recent AI boom worldwide.
Taiwan’s recent achievements in Europe include TSMC inaugurating its 12-inch wafer fab in Dresden through a joint venture with Robert Bosch, Infineon Technologies, and NXP Semiconductors. The project, costing over €10 billion, sees TSMC holding a 70% stake, with EU funding of €5 billion approved under the EU Chips Act.
