Thursday, March 20, 2014:
Solder paste
In January 2014, Indium Corporation launched a new solder paste technology. BiAgX is a high-melting point lead-free solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard solder pastes with high lead content, it has passed MSL1 and thermal cycle testing done by several power semiconductor customers.
BiAgX is excellent for small, low-voltage QFN packages that are used in portable electronics (smartphone/tablet), automotive electronics and industrial applications. It excels in high temperature environments—in excess of 150°C. It requires minimal process adjustments and no capital expenditure when customers convert from processes based on a standard solder paste with high lead content.
For further details: Ph: 1-315-381-7524, abrown@indium.com, www.indium.com
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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
