Wednesday, July 23, 2014:
In April 2014, Indium Corporation introduced the SACm, a highly reliable solder paste that increases the drop-shock performance in portable electronics by 800 per cent, without compromising on thermal cycling. SACm is doped with manganese and contains less silver than other lead-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications. Indium8.9HF halogen-free, lead-free solder paste is one of the standard flux vehicles for SACm that provides excellent soldering performance under high temperatures and long reflow processes. It offers unprecedented stencil print transfer efficiency and works in a wide range of processes.
For further details: Ph: +65-6268-8678, asiapac@indium.com/sacm@indium.com, www.indium.com/SACm
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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
