The chipmaker is deploying the advanced lithography system for select production layers to refine manufacturing of its next-generation laptop processors.
Intel has started using ASML’s next-generation high numerical aperture (High-NA) extreme ultraviolet (EUV) lithography system to manufacture select layers of its flagship Panther Lake laptop processors, marking a significant step in the adoption of advanced chipmaking technology.
The move follows testing that began in 2024 and is intended to help Intel and ASML gather production data while refining the performance of the High-NA equipment. Rather than using the system across the entire manufacturing process, Intel is deploying it for specific chip layers as it integrates the technology into commercial production.
High-NA EUV lithography represents the latest advancement in semiconductor manufacturing, enabling chipmakers to print finer circuit patterns required for increasingly compact and powerful processors. The technology is expected to play a key role as the industry continues to shrink transistor dimensions.
However, widespread adoption has been tempered by its high cost and technical complexity. Each High-NA EUV system is priced at approximately US$400 million, roughly double the cost of a conventional EUV lithography machine, making deployment a significant investment for chip manufacturers.
Intel is producing Panther Lake processors using its 18A manufacturing process, which already relies on ASML’s standard EUV lithography systems. The High-NA tool is being introduced alongside the existing production flow to optimize manufacturing capabilities.
Intel received its first High-NA EUV machine in 2024 at its research and development facility in Hillsboro, Oregon, where the company develops next-generation semiconductor manufacturing technologies. The chipmaker declined to comment on ASML’s announcement.
