An SMT machine is an expensive piece of equipment. Hence, buyers need to plan very strategically prior to making a purchase as there are many choices offered by various companies. This article covers the recent advances in SMT machines, and features all that the market currently offers. We have also talked to several manufacturers of SMT equipment, to know about their expectations from the Indian market
Friday, November 22, 2013: Smaller, cheaper and faster are the features that the electronics manufacturing industry is looking for today. The Indian electronics industry is currently experiencing extremely rapid advances in technology, placing increasing demands on production machinery like surface mount technology (SMT) equipment to effectively increase manufacturing throughput and minimise defects. The demand for SMT machines is coming from emerging sectors like telecom, automotive, strategic electronics and healthcare. SMT machines must, therefore, be capable of placing components with a very high level of accuracy, to cope with an ever increasing variety and complexity of components, like smaller ball grid array (BGAs), tiny flip-chips (where the electrical connections are made directly to the chip’s silicon), etc, with the added need for high-quality standards.
The recent progress in LED technology and solidstate lighting has also led to a demand for SMT machines that can assemble LED components. In fact, the range of new and potential applications for LEDs in electronics is practically endless. The automated SMT assembly of LED components is possible with high-quality nozzles and feeders, which can effectively increase manufacturing throughput and minimise defects.
Hence, the SMT industry is expanding its manufacturing capabilities to meet these demands. An SMT machine is an expensive piece of equipment. So buyers need to plan very strategically prior to making a purchase, as there are many choices offered by various companies. Let’s look at the new machines and advanced technologies available in the different SMT machine categories that will help electronics companies to manufacture highly complex products within shorter periods of time, increasing the overall production rates while decreasing production costs.
PICK AND PLACE MACHINES
The pick and place segment is in a state of constant development. Although these machines are now capable of mounting on various levels (2.5 D mounting: in cavities, stacking, package on package, etc), the next step is real 3D mounting, where components are required to be placed at an angle. That demands an extra dimension on top of the existing X, Y, Z and R movements. While 3D mounting still needs special actions (while placement still uses X, Y, Z and R movements, the board also rotates), it won’t be long before standard SMT equipment will offer 3D mounting.

According to Suresh Nair, director, Leaptech Corporation, the latest trend is to offer hybrid placement capabilities—the pick and place machines can be added with dispensing heads for solder paste or glue. The applications vary from normal glue doting for heavier components before placement to high-end applications like package-on-package and bare die placement, where flux application is also part of the placement machine’s features.
“Even for LED board assembly for LED tubelights, which have long PCBs of up to 1200 mm, printing of solder paste becomes critical, as there are not many printers in the market that can handle such large PCBs. So solder paste dispensing by pick and place machines is handy for such applications,” says Suresh Nair.
Laser board warpage detection is another new technology being offered by pick and place machine manufacturers. Machines with this feature can detect any warping in the PCB and adjust the placement program accordingly. This feature also doubles up as a board stopper, in which case the PCB positioning for placement is accurately done by the laser source and no more mechanical stoppers are required.
| Some recent launches in pick & place machines | |
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Quality nozzles and feeders are at the core of the pick and place process. If the pick and place machine fails to pick parts consistently or hold on to the components while transporting from the feeder to the PCB, defects will occur. So proper feeder and nozzle selection is critical.
Many SMT manufacturers are also creating customed pick and place trays to allow for more accurate picking and transport processes. These machines have customised nozzles that enable LEDs to be picked, vision centred and placed at a high speed.

According to Irene Lim, product marketing director, ASM Pacific Technology Ltd, miniaturised components result in the need for pick and place equipment to be able to handle smaller components such as 01005 packaging. While component suppliers are working on smaller components, substrate suppliers likewise are exploring embedding technologies. This pushes the boundary of conventional placement equipment to be able to support better placement accuracy below 25 um. “With the need for more and more tailored products to suit different market segments, electronics manufacturers struggle with smaller and smaller batch sizes producing varying products with certain degree of commonalities. Such high mix production is no longer limited to high-cost manufacturing facilities but rather becoming more prevalent in lots of factories worldwide. To efficiently manage this kind of production, flexible pick and place machines coupled with good software control is strongly in demand. ASM Assembly Systems is no stranger to this arena as its flagship product—SIPLACE SX was precisely developed for such flexible production environment supporting many customers around the world,” explains Irene Lim.
However, not too many companies launched pick and place machines—either high volume or low and mid volume—in the last two years. Some manufacturers have just upgraded their existing machines to meet the demand from the market.
Fuji Machine Manufacturing Co Ltd launched the AIMEX IIS in November 2012. The AIMEX IIS is an all-in-one placement platform and a high speed machine, with capacity going up to 50,000 CPH. This optimum machine for high-mix low-volume production and variable-mix variable-volume production inherits concepts from the popular AIMEX, but with increased flexibility and expandability.
Samsung launched its EXCEN series in April 2012. These are high speed modular mounters that apply a high speed rotary head equipped with 16 nozzles. It has the world’s highest speed of 120,000 CPH among mounters of the same class, as well as the world’s highest area productivity.
On the other hand, Mirae Corporation upgraded its Mx400 series in July 2012, which has a dual gantry structure based on 2 x 6 axes heads. Its economical compact size ensures maximum productivity per unit area. It has an optional dual-lane conveyor, which enables two PCBs to work at high speeds simultaneously.
Juki Corporation has also upgraded the capabilities of the FX 3 to launch the FX 3R in January 2012. The FX 3R’s four independent beams, each with a six-nozzle-multi-laser head, alternately perform component picking and placement at two stations. A total of 24 components can be picked and centred simultaneously using high resolution, on-the-fly laser centring for high speed placement.
Among low and mid volume machines, Autotronik SMT launched its LD series of pick and place machines in February 2013, which is primarily suitable for LED assembly with a speed of 15,000 CPH. These machines can handle PCB lengths of 1200 mm in a single step. They can handle almost all types of LEDs up to a size of 8 mm×8 mm.
PRINTER SYSTEMS

SMT machinery requires solder paste to be screen printed onto the PCB prior to placing the surface mount components. The quality of a PCB depends on the quality of the initial solder paste deposits. Today, the smaller lead pitches and components make it more difficult to achieve accurate, unflawed and perfectly printed PCBs. This requires a high quality, precise printer that can handle small, mid-sized and high volumes.
According to Shailendra Mathur, general manager-India, ASYS, with a competitive market, manufacturers are looking for high productivity, yield and efficiency. In manufacturing, paste printing process is critical to address these deliverables. For this wish list, new printers will possibly take inputs from process innovations like closed- loop SPIs, best cleaning frequencies, fast substrate handling, etc. Additionally, component pitch size of < 0.3 mm will require higher accuracy machines print fast and accurately. Electronics today is high mix, high density, varied substrate oriented and so high accuracy prints for both fine and standard deposits adjacent on the same real estate, will be what future printers will need to address. Printers in future will have special squeegee technologies, different process stencils and work on high quality paste. Also printers will most likely accommodate a wide variety of substrates, have smartphone like MMIs, integrated paste and PCB surface analysis, intelligent response to substrate and printing variations clearly directed at highest productivity, yield ad efficiency, reducing operator dependence.
| Some recent launches in printer systems | |
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Today, printer systems have become very advanced. For example, Hitachi high-speed, high performance solder paste printers and Koh Young Technology’s 3D solder paste inspection (SPI) systems can talk to one another via Koh Young’s closed loop interface process control software. The process control software brings the SPI system and the printer together via a closed-loop communications link to not only identify defects in solder paste printing, but correct them with the printer. These machines now feature advanced technologies.
ASYS launched CONEXIO in November 2012, which is a future-oriented line concept for single and multiple lane applications. It allows individual process modules to be replaced or added to the line as required. Demand fluctuations or NPI can be addressed in the shortest possible time with CONEXIO.
Yamaha launched the YSP20 in June 2012, which is a dual-lane, dual-stencil printer with five-micron alignment repeatability. It has a unique ‘3S’ head (swing, single and squeegee) that can dynamically change the ‘attack’ angle as opposed to a fixed ‘w’ type conventional squeegee system.
In a nutshell, to achieve good printing results, a combination of the right paste material, the right equipment and the right process are necessary. Manufacturers must control the process and equipment variables to achieve good print quality.
REFLOW OVENS
Reflow ovens are used for reflow soldering of the surface mounted electronic components onto PCBs. These are of two types—infrared and convection ovens. These ovens contain multiple zones, each of which can be individually controlled for temperature. Generally, there are several heating zones and one or more cooling zones. The PCB moves through the oven on a conveyor belt, and is subjected to a controlled time-temperature profile. Reflow ovens are now available with advanced features.
In early 2012, Kurtz ERSA launched the Hotflow 3e series of ovens, which are versatile in nature. These can be offered as single track, dual-track or three-track variants, making it possible to solder three products at the same time, resulting in the highest throughput.
| Some recent launches in reflow ovens | |
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In April 2013, Rehm Thermal System launched the VX series, which offers a convection reflow soldering system that is distinguished by high levels of flexibility and productivity. This system comes with the strongest heating and cooling power in the industry, with robust transport systems. It is a high-volume reflow soldering oven for all SMT components.
Indian manufacturer EMS Technologies Pvt Ltd launched the Konark 145 in April 2012, and upgraded the Konark 257 as well. The Konark range of reflow ovens are the only Indian products with high-end features matching imported machines. These are cost-effective alternatives to imported machines, and are ideally suited for high-volume manufacturing. Konark 145 is a five-zone hot air convection reflow oven, which uses five top and five bottom hot air convection heating zones.
INSPECTION SYSTEMS
Automated optical inspection (AOI) systems and solder paste inspection (SPI) systems are today become essential tools in PCB assembly lines, particularly in industries where tough quality and safety standards apply. It is not just the increasing board density and the miniaturisation of components that are driving this trend—the use of AOI and SPI systems in the overall process control and test strategy have proved to be an unmatched return on investment. Over the years, makers of these machines have technically enhanced the features in order to meet all the challenges of today’s complex PCB assembly.
| Some recent launches in inspection systems | |
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In this category, CyberOptics Corporation launched the SE600 in July 2013, which is an advanced, high performance SPI system. It brings together accuracy and world-class usability on a single platform, making it the ideal inspection solution for automotive, medical, military and other niche markets.
ASYS has also launched the Insignum 3000 scanner in November 2012, which is a reading system consisting of a stepper motor driven X/Y-axle-system with a scanner or camera. The product is transported on the conveyor and up against a stopper.
SOLDERING SYSTEMS
SMT soldering machines constitute a crucial part of the manufacturing process as they help in evaluating the consistency in the soldering quality of a product. SMT soldering machines cover an array of equipment including SMT reflow soldering (reflow ovens), SMT/BGA soldering stations (used for single component placement/removal and also known as SMT/BGA rework stations), and SMT discrete soldering equipment like soldering stations, hot tweezers, infra-red guns (predominantly used in low volume/prototype development), etc.
In this category, Speedline launched Omni ES series in May 2013, which is a combination of innovation and industry proven technology, providing an efficient and reliable solution for SMT soldering applications. Made to deliver high performance, it is also an easy to use, reliable and efficient reflow system.
| Some recent launches in soldering systems |
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In April 2013, Inertec GmbH launched CUBE 460, which is a fully automated system, and can be customised as per desired soldering angle with an optional camera for online programming and process verification.
By using SMT soldering machines, manufacturers can improve thermal conductivity and lower assembly costs, due to lower labour involvement and the use of less solder paste. Today, these machines are more technologically advanced and use the latest soldering technology, which can reliably solder surface mount components, particularly those with very fine pitch leads. In BGA, the pads are under the device and are not visible. Today, BGA solder techniques are tried and tested and have been proved to be very reliable. These machines are now available with advanced technologies.
DISPENSING SYSTEMS
The adhesive dispensing process transfers adhesives onto the PCB solder mask in a position suitable for holding the components until the PCB is wave soldered.
The equipment used for adhesive dispensing can be inline or offline. Choosing an inline or offline system depends on the particular job at hand. If the process is for small production batches, an offline dispenser unit will be adequate, but for high output placement lines, where the product cycle time is short, an inline system is necessary. For both inline and offline systems, three different dispensing methods are used—time/pressure, auger pump and piston pump.
| Some recent launches in dispensing systems |
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In June 2012, Precision Valve Automation (PVA) launched a UV2000 ultraviolet light curing oven, which uses UV lamps to initiate a fast ultraviolet light polymerisation (curing) of adhesives and coatings in an efficient inline process. Various UV beam widths are available to accommodate substrate dimensions. This model of oven is ideal when speed is of the essence, conveyor profiling is important, upgrading is a possibility, and when easy access is critical.
In November 2011, Speedline Technologies launched Camalot FX-D, which is still in demand as it is a cost-effective dispensing system that features a unique ‘plug and play’ design.
REWORK STATIONS
Defective surface mount components can be repaired by using soldering irons or a non-contact rework system. A rework system is a better choice because SMD work with a soldering iron requires considerable skill, and in many cases is not feasible at all. There are essentially two non-contact soldering/desoldering methods—infrared soldering and soldering with hot gas. With infrared soldering, the energy for heating up the solder joint is transmitted by long or short wave infrared electromagnetic radiation. With the current technological advancements, one system unifies all essential process steps, offering manual to automatic soldering, de-soldering and placement, requiring only little action from the operator.
| Some recent launches in rework stations |
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OK International launched the Metcal MX-5200 soldering, desoldering and rework series, which offers increased productivity and process control, and is now available with dual simultaneous use ports. The MX-5200 now features a dual simultaneous use option, which means that two hand pieces can work from one power supply at the same time. The dynamic option enables the two hand pieces to share an 80 watt power output, based on demand, adding even more application flexibility and speed.
In January 2012, PDR launched the IR-E3 SMT/BGA rework system, using PDR’s patented ‘Focused IR’ technology. It has been specifically designed to cope with the challenges of repairing PCB assemblies. The system is tool-free, gas-free, modular and upgradeable, all of which produces 100 per cent yield BGA rework.
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“We’re now making rapid strides into high volume segment with YSM40 |
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Arimoto Ichiro, senior supervisor, Yamha Motor Co Ltd Yamaha Motor Intelligent Machinery (IM) is the SMT division of Yamaha Motor Co Ltd, which sells and supports solutions for the SMT market—from screen printing and dispensing to placement and AOI machines EB: What are the new machines you have launched recently? Responding to the increasing demand for high-end, flexible and integrated solutions, we have two machines to offer—3D AOI and YSD high-speed dispensing system. These machines will help to raise efficiency and productivity. The YSi-X, the 2D/3D X-ray is a multifunction 3D X-ray hybrid inspection system capable of complete in-line inspection of all facets of PCBs. EB: Which machines sell the most in India? And have you seen an increase in sales for your machines in India? Our surface mounters, particularly YS12E and YS24, sell the most. This year has been better for us and we expect the trend to continue. Also, some automotive companies are planning to invest in India, so we have a chance to get more customers in the country. EB: Are your machines priced differently for India? Yes. They are sold at a comparatively lower price. EB: What are the factors that drive the sales of SMT inspection equipment? Advanced product technology, responsiveness, reliability and quality of inspection are major drivers in the SMT inspection equipment market. High performance devices in the telecom, automotive, and consumer electronics space are expected to further drive demand for SMT inspection. EB: What are your strategies for next year? We would like to have more EMS companies as our customers, since this segment is growing in India. EB: Technologically, how do you maintain an edge over your competitors? The SMT equipment market is currently in the process of maturing. We focus on high durability and quality service, besides high-quality machines. Traditionally, our strength has been machines for mid volume, high mix. However, we are now making rapid strides into high volume segment as well with the help of our new platform YSM40. |
| Check points for investment in SMT equipment |
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By YB Kang, MD, YB Techsolution Pvt Ltd Screen printers
Mounters
Productivity and the loss of material are directly linked to the responsiveness of equipment and the precision in loading. The existing standard shapes of parts used in electronics are rapidly changing. Mounter manufacturers develop and upgrade vision software for clients in response to the new parts being developed. It is important to check if such support is available. Reflow
Use common spare parts which are easily available in the market. When dealers do not have the parts at the time the equipment breaks down, a long wait or the expiration of the warranty period can lead to higher costs for replacement parts. |
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