iC-Haus Expands Production Facility In Germany, Celebrates 35 Years

• The 18,000 m2 company’s headquarter will focus on development, production, qualification, testing, and sales
• iC-Haus offers products including twin-encoder chips and reflective absolute encoders
• The production facilities at the Bodenheim site aim to benefit iCs and microsystems with integrated optical or magnetic sensors

iC-Haus has announced the expansion of its production capacity in Bodenheim, Germany, with its fifth building section. The 18,000 m2 company’s headquarter will focus on development, production, qualification, testing, and sales. This year also marks the 35th anniversary of the company.

Services and series products with the “iC” as a trademark for quality and a high degree of innovation and integration are offered close to and in the language of the customers. Laser drivers for nanosecond pulses and simultaneous pulse powers of several 100 W by iC-Haus offer customized solutions for LIDAR applications. 

Products

Furthermore, iC-Haus also offers products including twin-encoder chips and reflective absolute encoders, which as system-on-chips also contain optical sensors in addition to mixed-mode circuit blocks. The production facilities at the Bodenheim site aim to benefit iCs and microsystems with integrated optical or magnetic sensors.

Introducing iC-Haus 

iC-Haus GmbH is an independent German manufacturer of standard iCs (ASSP) and customized ASiC semiconductor solutions. The iC-Haus cell libraries in CMOS, bipolar, and BCD technologies are equipped to realize the design of the sensor, laser/opto, and actuator ASiCs, among others. The iCs are assembled in standard plastic packages or using iC-Haus chip-on-board technology to manufacture complete microsystems, multichip modules, and sensors housed in optoBGA or optoQFN packages. 

About the group

The iC-Haus Group includes design and application centers and sales partners in Germany, Spain, the United States, Japan, South Korea, and China. Approximately 320 employees work at the headquarters in Bodenheim in areas including development, wafer processing, assembly, testing, and qualification of integrated circuits and microsystems.