Currently the semiconductor business of Bosch is under the Mobility Electronics Division of the company.
The bosch group, a leading supplier of technology and services globally announced on Tuesday, that it’ll be establishing a dedicated semiconductor division by January 2028. Currently the semiconductor business of Bosch is under the Mobility Electronics Division of the company.
The restructuring is done with an aim to put the semiconductor business of Bosch on a firmer footing and is a part of the reorganisation of its corporate structure, as announced by Bosch at the end of October 2026. Effective January 1, 2028, the company will transfer the semiconductor operations to a new division, and targets to generate 5 billion euros ($5.6 billion) in semiconductor sales by 2030.
“Semiconductors are the linchpin of our connected world and, at the same time, a key success factor for all of Bosch’s divisions,” says Markus Heyn, deputy chairman of the board of management of Robert Bosch GmbH and chairman of the Mobility business sector.
The German firm is already a strong player in the semiconductor sector with more than 60 years of experience and a strong demand for its chips in the humanoid robotics sector. The company has a global presence with over 40 sites worldwide dedicated to research, and production.
Bosch recently invested $3.4 billion in its wafer fabs in Dresden and Reutlingen in Germany, $2 billion in its facility in Roseville, California in the US to manufacture silicon carbide (SiC) chips, and it also plans to expand its test centre in Penang, Malaysia by mid-2030s strengthening its global resilience.
Moreover, the company said that it’ll expand its manufacturing capacity to external partners in future while expanding its foundry business. After the reorganisation the Mobility Electronics Division of Bosch will constitute business related to electronic control for automotive applications.
