Can India move from chip design powerhouse to global semiconductor manufacturer? Leaders at EPDMC 2026 reveal the opportunities, gaps and next steps.
The first International Electronics, Packaging, Design and Manufacturing Conference (EPDMC 2026) was held at Manav Rachna International Institute of Research and Studies (MRIIRS), bringing together industry leaders, researchers and students to examine the evolving landscape of India’s semiconductor and electronics manufacturing ecosystem.
The inaugural conference focused on the intersection of electronics packaging, design innovation, manufacturing scalability and industry-ready skills. Participants from academic institutions, technology companies and international organisations attended technical presentations, panel discussions, tutorials and networking engagements designed to facilitate knowledge exchange. Topics ranged from heterogeneous integration and advanced semiconductor packaging to sustainable manufacturing, digital twins, embedded systems and applications in Internet of Things and smart technologies.
Across sessions, speakers highlighted the importance of developing a resilient and self-reliant semiconductor supply chain in India. While the country has built strong capabilities in semiconductor design, discussions emphasised the need to expand into backend manufacturing, reliability engineering and system-level integration. Strengthening collaboration between academia and industry was repeatedly identified as essential for building the skilled workforce required to support this growing ecosystem.
In an exclusive interaction with EFY, industry leaders shared their perspectives on the opportunities and challenges shaping the sector.
Ajit Manocha, President and Chief Executive of SEMI, said, “India has only just begun its semiconductor journey, but the progress so far is encouraging. The Micron facility represents an important milestone, and several other projects are already under construction. Building a globally competitive semiconductor ecosystem requires reliable power, robust infrastructure and strong supply chain coordination. Despite structural gaps and geopolitical complexities, India is on the right track. Ultimately, success will be defined by India’s ability to manufacture semiconductors domestically and supply them to the world.”
Ravi Mahajan, Fellow in Advanced Packaging Technology Manufacturing at Intel, says, “Advanced packaging is becoming as critical as transistor scaling because it complements it. By integrating optimised components on a common platform, heterogeneous integration enables more efficient, higher-performance systems. Technologies such as chiplets and standardised interfaces allow different design elements to be combined and tailored for specific applications. For countries like India, the opportunity lies in leveraging strong design capabilities to contribute to this evolving ecosystem while infrastructure continues to develop.”
Adding an institutional perspective, Umesh Dutta, CEO of Manav Rachna Innovation and Incubation Foundation, said the conference reflects the growing opportunities for Indian students in emerging fields. “Semiconductor and quantum technologies present immense potential for our students, but exposure to real industry challenges is essential,” he said. “Through a 360 degree talent development approach that combines technical mentoring, incubation and industry engagement, we aim to nurture startups, strengthen domestic capabilities and contribute to reducing imports while expanding exports.”
At a time when India is seeking to strengthen its position in the global semiconductor value chain, the event created a platform for dialogue between academia and industry.
