The agenda behind this set up is to make a strong presence of India in the global semiconductor industry
Paras Semiconductors Private Limited has recently inked an agreement with the Madhya Pradesh State Electronics Development Corporation (MPSEDC) to set up an advanced semiconductor packaging and Outsourced Semiconductor Assembly and Test (OSAT) facility in the Indore
The project has approximately investment of ₹6,200 crore (around US$644 million). The agenda behind this set up is to make a strong presence of India in the global semiconductor industry under the India Semiconductor Mission.
The new facility’s major highlight will be on advanced integrated circuit packaging technologies, including 2.5D and 3D heterogeneous integration, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, and flip-chip assembly. These capabilities are expected to support the packaging and testing of next-generation semiconductor devices.
According to the company, the facility will initially cater to semiconductor devices used in sensor technologies, optical, and optronic systems, with future expansion planned for artificial intelligence (AI) chips.
The project is expected to generate more than 2,500 direct jobs while also supporting the growth of ancillary industries and supplier networks across Madhya Pradesh. Once operational, the facility is expected to enhance India’s domestic semiconductor manufacturing capabilities and reduce dependence on overseas packaging and testing services.
