The investment will fund HBM chip packaging, advanced chip materials, displays and batteries as Samsung ramps up support for AI infrastructure.
Samsung Group has announced plans to invest 140 trillion won (about $90 billion) in South Korea’s Chungcheong province to expand production of semiconductors, display panels, batteries and advanced chip materials.
The investment includes 67 trillion won from Samsung Display to strengthen display manufacturing in Asan and Cheonan. Samsung Electronics will invest 56 trillion won to build advanced packaging facilities for high-bandwidth memory (HBM) chips in Onyang and Cheonan, supporting growing demand for AI-focused semiconductors.
Samsung SDI plans to allocate 9 trillion won through 2040 to expand production and research of next-generation batteries in Cheonan. Meanwhile, Samsung Electro-Mechanics will invest 8 trillion won by 2040 in Sejong to manufacture advanced chip packaging materials for AI servers while also supporting the development of skilled local talent.
The regional investment plan was unveiled by Samsung Display CEO Yi Chung during an event attended by South Korean President Lee Jae Myung on Thursday.
The announcement follows Samsung Group’s broader investment strategy unveiled earlier this week, as the company accelerates spending across key technologies tied to artificial intelligence, advanced semiconductor packaging, next-generation displays and energy storage.
The investments are expected to reinforce Chungcheong’s position as a major manufacturing hub for Samsung’s high-tech businesses while strengthening South Korea’s semiconductor and battery supply chains amid rising global demand for AI infrastructure.
